3D IC Market Predicted to Hit US$ 46.42 Billion by 2028

IMARC Group, a leading market research company, has recently releases report titled “3D IC Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028.” The study provides a detailed analysis of the industry, including the global 3D IC market size, growth, share, trends, and forecasts. The report also includes competitor and regional analysis and highlights the latest advancements in the market.

What is 3D IC?

Three-dimensional (3D) integrated circuit (IC) technology refers to the integration of various silicon dies, chips, and wafers in a vertical stacking manner. This technique combines these components into a single package using silicon vias (TSVs) and hybrid bonding procedures. The process also includes 3D wafer-level chip-scale packaging (WLCSP), beam re-crystallization, solid phase crystallization, and wafer bonding. Compared to traditional two-dimensional (2D) ICs, 3D ICs offer improved speed, a smaller footprint, increased functional density, and reduced power consumption within a smaller area. In addition to this, they provide higher bandwidth, flexibility, and the ability to integrate several technologies, resulting in faster signal transitions and better electrical performance. As a result, 3D ICs find widespread applications across various fields, such as microelectronics, photonics, logic imaging, optoelectronics, and sensors.

How Big Is the 3D IC Market?

The global 3D IC market size reached US$ 13.89 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 46.42 Billion by 2028, exhibiting a growth rate (CAGR) of 21.72% during 2023-2028.

Global Industry Trends and Drivers:

The extensive product utilization in several industries, including aerospace, automotive, communications, and telecom, the expanding electronics industry, and the escalating demand for compact and advanced consumer electronics, including laptops, smartphones, and tablets, are primarily driving the 3D IC market. Besides this, the elevating requirement for this technology in smart home devices, such as security locks, thermostats, fan controllers, smart smoke detectors, window sensors, energy monitors, and healthcare devices, including hearing aids, visual aids, and heart monitors, is further augmenting the market growth. Moreover, the rising consumer awareness toward the various benefits of 3D ICs, such as improved speed, memory, durability, efficiency, performance, and reduced timing delays, is also catalyzing the global market. Apart from this, the incorporation of the internet of things (IoT) solutions with wireless technologies and the development of advanced packaging systems by manufacturers to enhance production are acting as significant growth-inducing factors. Furthermore, the increasing need for high-bandwidth memory (HBM) and ongoing derivative diversification are anticipated to propel the 3D IC market over the forecasted period.

3D IC Market Growth and Opportunities:

The 3D IC (Three-Dimensional Integrated Circuit) market is poised for significant growth and offers lucrative opportunities. The demand for advanced semiconductor packaging solutions has fueled the adoption of 3D IC technology. 3D ICs provide higher integration density, improved performance, and reduced power consumption compared to traditional 2D ICs. This technology enables the stacking of multiple layers of integrated circuits, enhancing the overall functionality and efficiency of electronic devices. The growing demand for compact and high-performance electronic devices in various industries, including consumer electronics, telecommunications, automotive, and healthcare, is a key driver for the 3D IC market. Additionally, the increasing complexity of electronic systems, along with the need for miniaturization and increased functionality, presents growth opportunities. The development of advanced manufacturing processes, such as through-silicon via (TSV) technology, and the emergence of new materials and packaging techniques further contribute to market growth.

What Is Included In Market Segmentation?

The report has been segmented the market into following categories:

Type Insights:

• Stacked 3D
• Monolithic 3D

Component Insights:

• Through-Silicon Via (TSV)
• Through Glass Via (TGV)
• Silicon Interposer

Application Insights:

• Logic
• Imaging and Optoelectronics
• Memory
• MEMS/Sensors
• LED
• Others

End User Insights:

• Consumer Electronics
• Telecommunication
• Automotive
• Military and Aerospace
• Medical Devices
• Industrial
• Others

Regional Insights:

• North America
  • United States
  • Canada
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa

The report provides a comprehensive analysis of the industry key players listed below:

Advanced Micro Devices Inc., MonolithIC 3D Inc.